Invention Grant
- Patent Title: Method for manufacturing memory and memory
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Application No.: US17457819Application Date: 2021-12-06
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Publication No.: US12082393B2Publication Date: 2024-09-03
- Inventor: Qiang Wan , Jun Xia , Kangshu Zhan , Sen Li , Tao Liu , Penghui Xu
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2110160895.5 2021.02.05
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H10B12/00

Abstract:
A method for manufacturing a memory and a memory is provided. The method for manufacturing a memory includes: providing a substrate; stacking an electrode support structure, a protective layer and a first mask layer in sequence on the substrate; patterning the first mask layer on an array region, and etching the protective layer, the electrode support structure and the substrate by using the patterned first mask layer as a mask, to form capacitor holes penetrating the protective layer and the electrode support structure and extending into the substrate; removing the first mask layer; and forming a first electrode layer on side walls and bottom walls of the capacitor holes, a top surface of the first electrode layer being flush with a top surface of the electrode support structure.
Public/Granted literature
- US20220254782A1 METHOD FOR MANUFACTURING MEMORY AND MEMORY Public/Granted day:2022-08-11
Information query
IPC分类: