Invention Grant
- Patent Title: Capacitor structure and method of forming thereof
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Application No.: US18457366Application Date: 2023-08-29
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Publication No.: US12082398B2Publication Date: 2024-09-03
- Inventor: Jyun-Hua Yang , Kai Hung Lin
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- The original application number of the division: US17659845 2022.04.20
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L49/02

Abstract:
A method of forming a capacitor structure includes following operations. A first electrode is formed. A hafnium-zirconium oxide (HZO) layer is formed over the first electrode under a first temperature. An interface dielectric layer is formed over the HZO layer under a second temperature greater than the first temperature. A second electrode is formed over the interface dielectric layer. The HZO layer and the interface dielectric layer are annealed.
Public/Granted literature
- US20230413527A1 CAPACITOR STRUCTURE AND METHOD OF FORMING THEREOF Public/Granted day:2023-12-21
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