Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US18324245Application Date: 2023-05-26
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Publication No.: US12082421B2Publication Date: 2024-09-03
- Inventor: Tzu-Yu Chen , Sheng-Hung Shih , Fu-Chen Chang , Kuo-Chi Tu , Wen-Ting Chu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02 ; H01L49/02 ; H10B53/30

Abstract:
A semiconductor device includes a bottom electrode, a top electrode, a sidewall spacer, and a data storage element. The sidewall spacer is disposed aside the top electrode. The data storage element is located between the bottom electrode and the top electrode, and includes a ferroelectric material. The data storage element has a peripheral region which is disposed beneath the sidewall spacer and which has at least 60% of ferroelectric phase. A method for manufacturing the semiconductor device and a method for transforming a non-ferroelectric phase of a ferroelectric material to a ferroelectric phase are also disclosed.
Public/Granted literature
- US20230309318A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-09-28
Information query
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