Invention Grant
- Patent Title: High-density microneedle
-
Application No.: US16767117Application Date: 2018-11-28
-
Publication No.: US12083306B2Publication Date: 2024-09-10
- Inventor: Sung Youn Cho
- Applicant: LABNPEOPLE CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: LABNPEOPLE CO., LTD.
- Current Assignee: LABNPEOPLE CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: HAUPTMAN HAM, LLP
- Priority: KR 20170169505 2017.12.11
- International Application: PCT/KR2018/014810 2018.11.28
- International Announcement: WO2019/117510A 2019.06.20
- Date entered country: 2020-05-27
- Main IPC: A61M37/00
- IPC: A61M37/00 ; A61L31/02 ; A61L31/14
Abstract:
A high-density microneedle of the present disclosure includes: a sheet portion attached to skin; a substrate portion arranged on the sheet portion; and a plurality of insertion pieces arranged on the substrate portion, wherein the substrate portion is arranged on the sheet portion while having a plurality of layers formed therein.
Public/Granted literature
- US1280571A Stop mechanism. Public/Granted day:1918-10-01
Information query
IPC分类:
