- Patent Title: Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same
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Application No.: US16970822Application Date: 2019-03-06
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Publication No.: US12083784B2Publication Date: 2024-09-10
- Inventor: Yoshitaka Minakata , Toshitaka Yamagata , Saori Inoue , Ryo Yoshimatu , Ryuji Koga
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 18041238 2018.03.07
- International Application: PCT/JP2019/008969 2019.03.06
- International Announcement: WO2019/172345A 2019.09.12
- Date entered country: 2020-08-18
- Main IPC: B32B9/04
- IPC: B32B9/04 ; B32B9/00 ; B32B37/10

Abstract:
A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.
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