Invention Grant
- Patent Title: Processing apparatus and processing method
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Application No.: US17590799Application Date: 2022-02-01
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Publication No.: US12084765B2Publication Date: 2024-09-10
- Inventor: Reita Igarashi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 21015290 2021.02.02
- Main IPC: C23C16/455
- IPC: C23C16/455 ; H01L21/22

Abstract:
A processing apparatus includes: a processing container; a first injector extending in a longitudinal direction along an inner wall of the processing container, wherein the first injector includes a first introduction port formed at a lower end and first gas holes formed in the extending portion; and a second injector extending upward along the inner wall of the processing container, folded back at an upper portion, and then extending downward, wherein the second injector includes a second introduction port formed at a lower end of an upward extending portion and second gas holes formed in a downward extending portion. The first injector includes a first throttle portion having a cross-sectional area decreasing as a distance from the first introduction port increases. The second injector includes a second throttle portion formed in the downward extending portion and having a cross-sectional area decreasing as a distance from the second introduction port increases.
Public/Granted literature
- US20220243329A1 PROCESSING APPARATUS AND PROCESSING METHOD Public/Granted day:2022-08-04
Information query
IPC分类: