Invention Grant
- Patent Title: Temperature sensor probe
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Application No.: US17367846Application Date: 2021-07-06
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Publication No.: US12085458B2Publication Date: 2024-09-10
- Inventor: Guokuan Liang , Xiaojian Wang , Wenjie Wu , Xiao Liu
- Applicant: Therm-O-Disc Incorporated
- Applicant Address: US OH Mansfield
- Assignee: Therm-O-Disc, Incorporated
- Current Assignee: Therm-O-Disc, Incorporated
- Current Assignee Address: US OH Mansfield
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN 2110500367.X 2021.05.08
- Main IPC: G01K7/22
- IPC: G01K7/22 ; G01K1/08 ; G01K1/16 ; G01K7/24

Abstract:
A temperature sensor including a body made from a thermally and electrically conductive material, the body defined by a peripheral wall extending along a longitudinal axis from an open proximal end to a closed distal end. The proximal end defining an opening to an internal cavity of the body. A thermally responsive element including an outer surface, a temperature sensitive resistor electrically connected to a first lead, a second lead, and a connector block disposed substantially within the internal cavity. The inner surface of the peripheral wall defines the shape of a right circular cone at the distal end. The outer surface of the temperature sensitive resistor is in direct contact with the inner surface of the peripheral wall at the distal end. One of a thermally conductive and curable potting material and a thermally conductive grease disposed in the cavity and substantially surrounding the temperature responsive element.
Public/Granted literature
- US20220357216A1 Temperature Sensor Probe Public/Granted day:2022-11-10
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