Invention Grant
- Patent Title: Systems and methods for wafer bond monitoring
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Application No.: US18448766Application Date: 2023-08-11
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Publication No.: US12085518B2Publication Date: 2024-09-10
- Inventor: Chih-Yu Wang , Hsi-Cheng Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- The original application number of the division: US16806199 2020.03.02
- Main IPC: G01N21/95
- IPC: G01N21/95 ; H01L21/50 ; H01L21/60 ; H01L21/66
Abstract:
Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
Public/Granted literature
- US20230393081A1 SYSTEMS AND METHODS FOR WAFER BOND MONITORING Public/Granted day:2023-12-07
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