Invention Grant
- Patent Title: Display substrate, manufacturing method, display motherboard, and display device
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Application No.: US17753246Application Date: 2021-04-29
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Publication No.: US12085811B2Publication Date: 2024-09-10
- Inventor: Jiarong Liu , Heng Wang , Zhixiao Yao
- Applicant: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: McCoy Russell LLP
- International Application: PCT/CN2021/090942 2021.04.29
- International Announcement: WO2022/226883A 2022.11.03
- Date entered country: 2022-11-03
- Main IPC: G02F1/1347
- IPC: G02F1/1347 ; G02F1/1333 ; G02F1/1339 ; G02F1/1368 ; H01L27/12

Abstract:
The present disclosure provides a display substrate, including an array substrate, a color filter substrate, and a liquid crystal layer and a sealant arranged therebetween. A sealing cavity for receiving the liquid crystal layer is defined by the sealant, the array substrate and the color filter substrate. The display substrate is provided with a bonding side surface bonded to a chip on film, the sealant at least includes a first portion including a first side surface and a second side surface flush with the bonding side surface. The array substrate includes a display region and a non-display region surrounding the display region. A bonding pin is provided in the non-display region, extends to a side surface of the display substrate, and is exposed to the outside. The present disclosure further provides a method for manufacturing the display substrate, a display motherboard, and a display device.
Public/Granted literature
- US20240111191A1 DISPLAY SUBSTRATE, MANUFACTURING METHOD, DISPLAY MOTHERBOARD, AND DISPLAY DEVICE Public/Granted day:2024-04-04
Information query
IPC分类: