Invention Grant
- Patent Title: Ultra-thin, ultra-low density films for EUV lithography
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Application No.: US18231000Application Date: 2023-08-07
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Publication No.: US12085844B2Publication Date: 2024-09-10
- Inventor: Marcio D. Lima , Takahiro Ueda
- Applicant: LINTEC OF AMERICA, INC.
- Applicant Address: US TX Plano
- Assignee: LINTEC OF AMERICA, INC.
- Current Assignee: LINTEC OF AMERICA, INC.
- Current Assignee Address: US TX Plano
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Main IPC: G03F1/22
- IPC: G03F1/22 ; G03F1/64 ; G03F7/00
Abstract:
A filtration formed nanostructure pellicle film is disclosed. The filtration formed nanostructure pellicle film includes a plurality of carbon nanofibers that are intersected randomly to form an interconnected network structure in a planar orientation. The interconnected structure allows for a high minimum EUV transmission rate of at least 92%, with a thickness ranging from a lower limit of 3 nm to an upper limit of 100 nm, to allow for effective EUV lithography processing.
Public/Granted literature
- US20230393456A1 ULTRA-THIN, ULTRA-LOW DENSITY FILMS FOR EUV LITHOGRAPHY Public/Granted day:2023-12-07
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