Invention Grant
- Patent Title: Systems, methods, and apparatus for correcting thermal processing of substrates
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Application No.: US17463177Application Date: 2021-08-31
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Publication No.: US12085965B2Publication Date: 2024-09-10
- Inventor: Wolfgang R. Aderhold , Abhilash J. Mayur , Yi Wang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/324
- IPC: H01L21/324 ; G01J5/34 ; G05B13/02 ; G05D23/19 ; G05D23/27 ; G06N20/00 ; H01L21/66 ; H05B1/02 ; F27B17/00 ; H05B3/00

Abstract:
Aspects of the present disclosure relation to systems, methods, and apparatus for correcting thermal processing of substrates. In one aspect, a corrective absorption factor curve having a plurality of corrective absorption factors is generated.
Public/Granted literature
- US20230069444A1 SYSTEMS, METHODS, AND APPARATUS FOR CORRECTING THERMAL PROCESSING OF SUBSTRATES Public/Granted day:2023-03-02
Information query
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