An electronic device and method of manufacturing are disclosed. The electronic device includes a first metal segment including a first engagement portion, a second metal segment including a second engagement portion, the second metal segment spaced apart from the first metal segment so as to define a slit with the first metal segment, a support insulator engaging the first and second engagement portions, the support insulator supporting the first and second metal segments, and providing insulation between the first and second metal segments, and a filler enclosing at least a portion of the support insulator, and filling at least a portion of the slit. In the method, the first and second metal segments are arranged to define a slit therebetween, a support insulator is engaged to the isolated first and second metal segments, and the slit is filled with a material enclosing at least part of the support insulator.