Invention Grant
- Patent Title: Boot circuit, boot method, and boot system
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Application No.: US17159536Application Date: 2021-01-27
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Publication No.: US12086604B2Publication Date: 2024-09-10
- Inventor: Yen-Hsin Lai
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW 9103755 2020.02.06
- Main IPC: G06F9/4401
- IPC: G06F9/4401 ; G06F1/08

Abstract:
A boot circuit is configured to be coupled to a first memory. Boot information is stored in the first memory. The boot circuit is configured to receive the boot information. The boot circuit includes a first control circuit, a digital signal processing circuit, a detector circuit, a second control circuit, and a memory access circuit. The detector circuit is configured to generate a detection result according to the received boot information. The second control circuit is configured to control the first control circuit according to the detection result, to adjust a transmission parameter for transmitting the boot information. Based on the adjusted transmission parameter, the boot information is retransmitted from the first memory, via the memory access circuit, to the digital signal processing circuit. The digital signal processing circuit performs a boot process according to the retransmitted boot information.
Public/Granted literature
- US20210247986A1 BOOT CIRCUIT, BOOT METHOD, AND BOOT SYSTEM Public/Granted day:2021-08-12
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