Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US17840000Application Date: 2022-06-14
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Publication No.: US12087510B2Publication Date: 2024-09-10
- Inventor: Hwi Dae Kim , Won Chul Sim , Taek Jung Lee , Jin O Yoo , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210122914 2021.09.15
- Main IPC: H01G4/30
- IPC: H01G4/30 ; C04B35/468 ; C04B35/64 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/232

Abstract:
A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.
Public/Granted literature
- US20230091278A1 MULTILAYER CAPACITOR Public/Granted day:2023-03-23
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