Invention Grant
- Patent Title: Substrate processing system including coil with RF powered faraday shield
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Application No.: US17016888Application Date: 2020-09-10
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Publication No.: US12087557B2Publication Date: 2024-09-10
- Inventor: Shen Peng , Tamarak Pandhumsoporn , Anthony Nguyen , Dan Marohl
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- The original application number of the division: US15467588 2017.03.23
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C23C16/00 ; H01J37/32 ; H01L21/67 ; H10N30/082

Abstract:
A substrate processing system includes a processing chamber including a dielectric window and a substrate support arranged therein to support a substrate. A coil is arranged outside of the processing chamber adjacent to the dielectric window. A Faraday shield is arranged between the coil and the dielectric window. An RF generator is configured to supply RF power to the coil. The coil is coupled by stray capacitance and/or directly coupled to the Faraday shield. A capacitor is connected to one of the coil and the Faraday shield to adjust a position of a voltage standing wave along the coil.
Information query
IPC分类: