Invention Grant
- Patent Title: Composition for forming coating film and method for manufacturing semiconductor device
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Application No.: US17045304Application Date: 2019-04-02
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Publication No.: US12087576B2Publication Date: 2024-09-10
- Inventor: Tokio Nishita , Rikimaru Sakamoto , Yasunobu Someya , Takahiro Kishioka
- Applicant: NISSAN CHEMICAL CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NISSAN CHEMICAL CORPORATION
- Current Assignee: NISSAN CHEMICAL CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 18073623 2018.04.06
- International Application: PCT/JP2019/014615 2019.04.02
- International Announcement: WO2019/194175A 2019.10.10
- Date entered country: 2020-10-05
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C09D7/20 ; H01L23/29
Abstract:
Provided are: a composition for forming a coating film, the composition comprising (a) a polymer containing a structural unit represented by formula (1a) or (1b), and (b) a solvent including 51-99 mass % of water and 1-49 mass % of at least one organic solvent selected from the group consisting of propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether, methyl 2-hydroxyisobutyrate, ethyl 3-ethoxypropionate, and ethyl lactate; and a method for manufacturing a semiconductor device using the same.
Public/Granted literature
- US20210151318A1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-05-20
Information query
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