Invention Grant
- Patent Title: Method for dividing a bar of one or more devices
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Application No.: US17048383Application Date: 2019-05-17
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Publication No.: US12087577B2Publication Date: 2024-09-10
- Inventor: Takeshi Kamikawa , Srinivas Gandrothula
- Applicant: The Regents of the University of California
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: GATES & COOPER LLP
- International Application: PCT/US2019/032936 2019.05.17
- International Announcement: WO2019/222669A 2019.11.21
- Date entered country: 2020-10-16
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A method for dividing a bar of one or more devices. The bar is comprised of island-like III-nitride-based semiconductor layers grown on a substrate using a growth restrict mask; the island-like III-nitride-based semiconductor layers are removed from the substrate using an Epitaxial Lateral Overgrowth (ELO) method; and then the bar is divided into the one or more devices using a cleaving method.
Public/Granted literature
- US20210090885A1 METHOD FOR DIVIDING A BAR OF ONE OR MORE DEVICES Public/Granted day:2021-03-25
Information query
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