Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15919674Application Date: 2018-03-13
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Publication No.: US12087598B2Publication Date: 2024-09-10
- Inventor: Hideto Tateno , Daisuke Hara , Masahisa Okuno , Takuya Joda , Takashi Tsukamoto , Akinori Tanaka , Toru Kakuda , Sadayoshi Horii
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/448 ; H01L21/02 ; H01L21/673 ; H01L21/677

Abstract:
A substrate processing apparatus, includes: a process chamber accommodating a substrate; a vaporizer vaporizing a liquid precursor to generate reaction gas and deliver a processing gas containing the reaction gas and a carrier gas, the vaporizer including: a vaporization vessel; and a heater heating the liquid precursor introduced into the vessel; a carrier gas flow rate controller controlling flow rate of the carrier gas supplied to the vaporizer; a liquid precursor flow rate controller controlling flow rate of the liquid precursor; a processing gas supply pipe introducing the processing gas delivered from the vaporizer into the process chamber; and a gas concentration sensor detecting a gas concentration of the reaction gas contained in the processing gas delivered from the vaporizer into the processing gas supply pipe.
Public/Granted literature
- US20180204742A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-07-19
Information query
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