Invention Grant
- Patent Title: Transfer apparatus and processing system
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Application No.: US17489226Application Date: 2021-09-29
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Publication No.: US12087608B2Publication Date: 2024-09-10
- Inventor: Mengyang Xin , Fei Yu , Gonglin Luo
- Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. , Mattson Technology, Inc.
- Applicant Address: CN CA Beijing
- Assignee: Beijing E-Town Semiconductor Technology Co., Ltd,Mattson Technology, Inc.
- Current Assignee: Beijing E-Town Semiconductor Technology Co., Ltd,Mattson Technology, Inc.
- Current Assignee Address: CN Beijing; US CA Fremont
- Agency: Dority & Manning, P.A.
- Priority: CN 2110734999.2 2021.06.30
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B25J19/00 ; H01L21/687 ; B25J9/04

Abstract:
The present disclosure provides a transfer apparatus and a processing system. The transfer apparatus includes a first transfer assembly configured to transfer a first workpiece to a chamber. The transfer apparatus includes a second transfer assembly configured to transfer a second workpiece from the chamber. The transfer apparatus includes an isolation assembly disposed between the first transfer assembly and the second transfer assembly and configured to isolate energy transfer between the first workpiece and the second workpiece. The transfer apparatus further includes a support assembly configured to restrict the isolation assembly between the first transfer assembly and the second transfer assembly.
Public/Granted literature
- US20230005772A1 Transfer Apparatus And Processing System Public/Granted day:2023-01-05
Information query
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