Invention Grant
- Patent Title: Heat conducting sheet and electronic device using same
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Application No.: US17418826Application Date: 2020-01-15
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Publication No.: US12087661B2Publication Date: 2024-09-10
- Inventor: Akihito Konishi , Norihiro Kawamura , Youji Shirato , Naoki Saitou
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Rimon P.C.
- Priority: JP 19021381 2019.02.08 JP 19046614 2019.03.14
- International Application: PCT/JP2020/000984 2020.01.15
- International Announcement: WO2020/162117A 2020.08.13
- Date entered country: 2021-06-27
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/373

Abstract:
An object of the present disclosure is to provide a heat conducting sheet that can be easily positioned and can absorb unevenness of a heat generating component and a heat radiating component to reduce thermal resistance, and an electronic device using the same. Heat conducting sheet includes rectangular graphite sheet and attachment sheet that covers graphite sheet, graphite sheet being exposed at least two opposite sides. Graphite sheet is exposed from between attachment sheets, a thickness of attachment sheet is made thinner than (T0−T1) where an initial thickness of graphite sheet is T0, and a thickness when a pressure of 100 kPa is applied to the graphite sheet is T1.
Public/Granted literature
- US20220059431A1 HEAT CONDUCTING SHEET AND ELECTRONIC DEVICE USING SAME Public/Granted day:2022-02-24
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