Invention Grant
- Patent Title: QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
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Application No.: US17983249Application Date: 2022-11-08
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Publication No.: US12087673B2Publication Date: 2024-09-10
- Inventor: Abram Castro , Usman Chaudhry , Joe Adam Garcia , Mahmud Halim Chowdhury
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Frank D. Cimino
- The original application number of the division: US16411457 2019.05.14
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/67 ; H01L23/31 ; H05K1/18 ; H05K3/34 ; H01L21/66 ; H01L23/00
Abstract:
An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).
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