Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method of the semiconductor memory device
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Application No.: US18320818Application Date: 2023-05-19
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Publication No.: US12087686B2Publication Date: 2024-09-10
- Inventor: Jin Won Lee , Nam Jae Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR 20190089869 2019.07.24
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/528 ; H10B41/10 ; H10B41/27 ; H10B41/35 ; H10B43/10 ; H10B43/27 ; H10B43/35

Abstract:
There are provided a semiconductor memory device and a manufacturing method of the semiconductor memory device. A semiconductor memory device includes a lower stack structure on the substrate and including a plurality of lower layers stacked in a vertical direction, an intermediate stack structure on the lower stack structure and including a plurality of intermediate layers stacked in the vertical direction, a plurality of grooves in the contact region and penetrating the intermediate stack structure, the plurality of grooves exposing the lower stack structure at different depths, and a plurality of steps formed along sidewalls of the grooves.
Public/Granted literature
- US20230298992A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2023-09-21
Information query
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