An oxide film (4) is provided on an upper surface of the semiconductor substrate (1). A guard ring (3) is provided on the upper surface of the semiconductor substrate (1). An organic insulating film (6) directly contacts the oxide film (4) in a termination region (7) between the guard ring (3) and an outer edge portion of the semiconductor substrate (1). A groove (8) is provided on the upper surface of the semiconductor substrate (1) in the termination region (7). The groove (8) is embedded with the organic insulating film (6).