A method and device for bonding a first substrate to a second substrate at contact surfaces of the substrates.
The method includes the following steps: mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the substrate holders are arranged in a chamber;



contacting the contact surfaces at a bond initiation surface; and
bonding the first substrate to the second substrate from the bond initiation surface to the centre of the substrates.