Invention Grant
- Patent Title: Film pattern and methods for forming the same
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Application No.: US17520373Application Date: 2021-11-05
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Publication No.: US12087742B2Publication Date: 2024-09-10
- Inventor: Ying-Chieh Chen
- Applicant: Skiileux Electricity Inc.
- Applicant Address: TW Taoyuan
- Assignee: SKIILEUX ELECTRICITY INC.
- Current Assignee: SKIILEUX ELECTRICITY INC.
- Current Assignee Address: TW Taoyuan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW 0105699 2021.02.19
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/50 ; H01L33/54

Abstract:
A method for forming a film pattern includes: providing a substrate having a surface on which the film pattern is to be formed; providing a pattern material containing a hot-melt glue; providing a mask, wherein the mask includes a light-transmitting portion and a light-non-transmitting portion, wherein the pattern material is between the substrate and the mask; irradiating the mask by using a light source capable of generating heat, wherein the light generated by the light source passes through the light-transmitting portion, so that the pattern material under the light-transmitting portion is attached to the surface of the substrate by the melting of the hot-melt glue; and removing the mask and the pattern material under the light-non-transmitting portion.
Public/Granted literature
- US20220271016A1 FILM PATTERN AND METHODS FOR FORMING THE SAME Public/Granted day:2022-08-25
Information query
IPC分类: