- Patent Title: Imaging apparatus and method for manufacturing imaging apparatus comprising first insulating film including upper wall located above contact plug and second insulating film including portion located above the upper wall
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Application No.: US18342423Application Date: 2023-06-27
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Publication No.: US12087789B2Publication Date: 2024-09-10
- Inventor: Kosaku Saeki
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Rimon P.C.
- Priority: JP 20002595 2020.01.10
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N25/76 ; H04N25/75

Abstract:
An imaging apparatus including a semiconductor substrate which includes a charge accumulation portion containing an impurity of a first conductivity type; a contact plug which is connected to the charge accumulation portion, contains an impurity of the first conductivity type, and is not silicide; a first insulating film which includes an upper wall located above the contact plug; and a second insulating film which includes a portion located above the upper wall. A material of the second insulating film is different from a material of the first insulating film.
Public/Granted literature
- US20230352501A1 IMAGING APPARATUS AND METHOD FOR MANUFACTURING IMAGING APPARATUS Public/Granted day:2023-11-02
Information query
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