Invention Grant
- Patent Title: Microstructure enhanced absorption photosensitive devices
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Application No.: US18385213Application Date: 2023-10-30
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Publication No.: US12087871B2Publication Date: 2024-09-10
- Inventor: Shih-Yuan Wang , Shih-Ping Wang
- Applicant: W&W Sens Devices, Inc.
- Applicant Address: US CA Los Altos
- Assignee: W&W Sens Devices, Inc.
- Current Assignee: W&W Sens Devices, Inc.
- Current Assignee Address: US CA Los Altos
- Agency: Wissing Miller LLP
- The original application number of the division: US17707429 2022.03.29
- Main IPC: H01L31/0236
- IPC: H01L31/0236 ; G02B6/122 ; G02B6/136 ; H01L23/66 ; H01L31/02 ; H01L31/0224 ; H01L31/0232 ; H01L31/024 ; H01L31/028 ; H01L31/0304 ; H01L31/0312 ; H01L31/0352 ; H01L31/036 ; H01L31/054 ; H01L31/0745 ; H01L31/075 ; H01L31/077 ; H01L31/105 ; H01L31/107 ; H01L31/18 ; G02B6/12

Abstract:
Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
Public/Granted literature
- US20240063317A1 MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES Public/Granted day:2024-02-22
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