Invention Grant
- Patent Title: Mounting board, electronic device, and electronic module
-
Application No.: US17771661Application Date: 2020-10-27
-
Publication No.: US12087874B2Publication Date: 2024-09-10
- Inventor: Akihiko Funahashi
- Applicant: Kyocera Corporation
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP 19197453 2019.10.30
- International Application: PCT/JP2020/040233 2020.10.27
- International Announcement: WO2021/085413A 2021.05.06
- Date entered country: 2022-04-25
- Main IPC: H01L31/12
- IPC: H01L31/12 ; H01L31/0232
Abstract:
A mounting board includes a base portion and a frame portion. The base portion includes a first upper surface including a first mounting region. The frame portion includes a second upper surface including a second mounting region and an inner wall surface intersecting with the second upper surface. The inner wall surface of the frame portion includes a first portion connecting with the second upper surface, and a second portion located opposite to the first portion with the first mounting region interposed therebetween. In the second portion, a first film that absorbs light and having a reflectance lower than a reflectance of the inner wall surface of the frame portion is located.
Public/Granted literature
- US20230268453A1 MOUNTING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE Public/Granted day:2023-08-24
Information query
IPC分类:
