- Patent Title: Supporting backplane, manufacturing method therefor and backplane
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Application No.: US17043937Application Date: 2019-10-31
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Publication No.: US12087892B2Publication Date: 2024-09-10
- Inventor: Zhiwei Liang , Wenqian Luo , Zhijun Lv , Yingwei Liu , Ke Wang , Zhanfeng Cao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- International Application: PCT/CN2019/114767 2019.10.31
- International Announcement: WO2021/081906A 2021.05.06
- Date entered country: 2020-09-30
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/00

Abstract:
The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.
Public/Granted literature
- US20230131247A1 SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE Public/Granted day:2023-04-27
Information query
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