Invention Grant
- Patent Title: Wireless chip to chip communication with selective frequency multiplexing with different modulation schemes
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Application No.: US17131866Application Date: 2020-12-23
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Publication No.: US12088329B2Publication Date: 2024-09-10
- Inventor: Mehnaz Rahman , Oner Orhan , Hosein Nikopour
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: VIERING, JENTSCHURA & PARTNER MBB
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/04

Abstract:
A transmitter for chip to chip communication may include a modulator and a transmit frequency converter. The modulator may modulate a first received signal according to a first modulation scheme. The modulator may also modulate a second received signal according to a second modulation scheme. The transmit frequency converter may center the first received signal on a first frequency that does not comprise a phase within a radio frequency (RF) domain to generate a first centered signal. The transmit frequency converter may also center the second received signal on a second frequency that comprises a phase within the frequency band to generate a second centered signal. The second centered signal may be orthogonal to the first centered signal. A frequency gap may be positioned between the first centered signal and the second centered signal within the frequency band.
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