The present disclosure discloses a bone conduction earphone. The bone conduction earphone may include a loudspeaker assembly. The bone conduction earphone may also include an ear hook assembly including a first ear hook housing, a connection member, and a second ear hook housing. One end of the connection member may be connected to the first ear hook housing, and the other end of the connection member may be connected to the loudspeaker assembly. The first ear hook housing may include a first sub-accommodating space, and the second ear hook housing may include a second sub-accommodating space. The first ear hook housing may be spliced and matched with the second ear hook housing by a first connection assembly such that the first sub-accommodating space and the second sub-accommodating space may be combined to form an accommodating space, and a length direction of the accommodating space may be perpendicular to a thickness direction of the accommodating space.