A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first via portion disposed in the first insulating layer; and a second via portion disposed in the second insulating layer; wherein the first via portion includes: a first via part passing through the first insulating layer; a first-first pad disposed on an upper surface of the first insulating layer and connected to an upper surface of the first via part; and a first-second pad disposed on a lower surface of the first insulating layer and connected to a lower surface of the first via part; wherein the second via portion includes: a second via part passing through the second insulating layer and having a lower surface connected to an upper surface of the first-first pad; a second pad disposed on an upper surface of the second insulating layer and connected to an upper surface of the second via part; wherein a width of the first-first pad is smaller than or equal to a width of the upper surface of the first via part; and wherein a width of the second pad is smaller than or equal to a width of the upper surface of the second via part.