Embodiments are disclosed of an immersion cooling device. The immersion cooling device includes a flow module adapted to be coupled to a heat-generating electronic component and immersed in an immersion cooling fluid. The flow module includes a housing with a channel therein, an inlet mounted the housing and fluidly coupled to the channel, the inlet being adapted to be submerged in the immersion cooling fluid, a pump positioned in the channel to accelerate the flow of immersion cooling fluid entering the channel through the inlet, and a fluid distribution interface mounted on the housing and fluidly coupled to the channel.