The present disclosure provides a circuit assembly that has a novel structure, with which it is possible to prevent the occurrence of a problem caused by an excessive repulsive force of a heat conductive member by controlling the repulsive force of the heat conductive member. A circuit assembly includes: a heat generation component; bus bars that are connected to connecting portions of the heat generation component; an insulating base member that holds the heat generation component and the bus bars; and an elastic heat conductive member that is in thermal contact with the bus bars. The bus bars press the heat conductive member in a mounting direction in which the bus bars are mounted on the base member. As a result of the bus bars abutting against bus bar positioning portions provided on the base member, the positions of the bus bars in the mounting direction are defined.