A method for manufacturing a display panel includes: providing a substrate motherboard, the substrate motherboard having multiple display panel regions and multiple cutting regions for dividing the plurality of display panel regions, each of the multiple display panel regions including a display region and a non-display region; providing multiple emitting devices in the display region; packaging the multiple light emitting devices to form a film package layer, the film package layer including at least one inorganic package layer; forming an insulation layer on a side of the inorganic package layer away from the substrate motherboard; patterning the insulation layer, and at the same time, performing an etching process to remove material of the inorganic package layer located in the plurality of cutting regions; and cutting the substrate motherboard to separate the multiple display panel regions and form multiple display panels.