Invention Grant
- Patent Title: Endoscope bonding structure and endoscope
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Application No.: US17098770Application Date: 2020-11-16
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Publication No.: US12089808B2Publication Date: 2024-09-17
- Inventor: Naohiro Kageyama , Takaharu Fujii
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP 18108492 2018.06.06
- Main IPC: A61B1/00
- IPC: A61B1/00 ; G02B23/24

Abstract:
An endoscope bonding structure includes a distal end rigid member, a tubular body, and a bonding agent. The distal end rigid member includes a first outer diameter part and a second outer diameter part. The tubular body includes a first inner diameter part and a second inner diameter part. An outer diameter of an outer periphery of the second outer diameter part decreases as a distance increases toward a proximal end side. The tubular body is fitted to an outer periphery in a state in which the tubular body is pressed to a distal end side.
Public/Granted literature
- US20210059505A1 ENDOSCOPE BONDING STRUCTURE AND ENDOSCOPE Public/Granted day:2021-03-04
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