Invention Grant
- Patent Title: Robot for high-temperature applications
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Application No.: US17335561Application Date: 2021-06-01
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Publication No.: US12090645B2Publication Date: 2024-09-17
- Inventor: Martin Hosek , Himanshu Shukla , Tuan Ha
- Applicant: Persimmon Technologies Corporation
- Applicant Address: US MA Wakefield
- Assignee: Persimmon Technologies Corporation
- Current Assignee: Persimmon Technologies Corporation
- Current Assignee Address: US MA Wakefield
- Agency: Harrington & Smith
- Main IPC: B25J17/00
- IPC: B25J17/00 ; B25J9/04 ; B25J11/00 ; B25J19/00

Abstract:
An apparatus including a robot drive; and a robot arm connected to the robot drive, where the robot arm includes a first link connected to the robot drive, a second link rotatably connected to the first link at a first rotatable connection, and an end effector rotatably connected to the second link at a second rotatable connection. The end effector includes a heat choke located between a substrate support area of the end effector and the second rotatable connection. At least one of the first rotatable connector or the second rotatable connection includes a rotary thermal coupling having interleaved members which are rotatable relative to each other.
Public/Granted literature
- US20210370528A1 Robot for High-Temperature Applications Public/Granted day:2021-12-02
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