Invention Grant
- Patent Title: Cooling module with microporous cooling structure applied thereto and method of locally cooling mold using the same
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Application No.: US17963117Application Date: 2022-10-10
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Publication No.: US12090696B2Publication Date: 2024-09-17
- Inventor: Keun Park , Junwon Lee
- Applicant: Foundation for Research and Business, Seoul National University of Science and Technology
- Applicant Address: KR Seoul
- Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee: FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Seoul
- Agency: NKL LAW
- Agent Jae Youn Kim
- Priority: KR 20210133653 2021.10.08
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B29C45/40 ; B33Y80/00

Abstract:
Provided is a cooling module to which a microporous cooling structure is applied, and a method of locally and conformally cooling a mold using the same. The cooling module to which a microporous cooling structure is applied which is installed at each high temperature region inside a mold core and allows supplied cooling fluid to flow thereinto to perform local and conformal cooling on a mold may include a body part inserted into the mold core, a microporous cooling structure which is inserted into an upper portion of the body part and in which micro unit cells are periodically and repeatedly formed to form a plurality of connected hollow portions, and a cooling channel including a conduit configured to pass the cooling fluid through the microporous cooling structure.
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