Invention Grant
- Patent Title: Low-density structured materials and methods of making and using same
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Application No.: US17920982Application Date: 2021-04-21
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Publication No.: US12091150B2Publication Date: 2024-09-17
- Inventor: Jan Willem Van Egmond
- Applicant: Jan Willem Van Egmond
- Applicant Address: US WV Charleston
- Assignee: Jan Willem Van Egmond
- Current Assignee: Jan Willem Van Egmond
- Current Assignee Address: US WV Charleston
- Agency: Dickinson Wright PLLC
- Agent Ross Spencer Garsson
- International Application: PCT/US2021/028380 2021.04.21
- International Announcement: WO2021/216695A 2021.10.28
- Date entered country: 2022-10-24
- Main IPC: B64B1/08
- IPC: B64B1/08 ; B64C1/08 ; E04B1/32 ; F17C1/00

Abstract:
A low-density structured material with good mechanical stability that can be used for three-dimensional structures, and methods to make and use same. In embodiments, the low-density structured material includes a first surface of interconnected polyhedrons, a plurality of tetrahedral arrangements whose base is the polyhedrons of the first surface, a second surface that is a web attached to the tetrahedral vertices of the tetrahedral arrangements, and panel materials overlying the web. The low-density structured material can be utilized in a variety of different structures.
Public/Granted literature
- US20230141407A1 LOW-DENSITY STRUCTURED MATERIALS AND METHODS OF MAKING AND USING SAME Public/Granted day:2023-05-11
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