Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
Abstract:
A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.
Information query
Patent Agency Ranking
0/0