Invention Grant
- Patent Title: Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
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Application No.: US17059655Application Date: 2019-05-31
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Publication No.: US12091542B2Publication Date: 2024-09-17
- Inventor: Saori Honda , Katsuya Yamamoto , Kazuyuki Higashita , Yoshitaka Ueno
- Applicant: Mitsubishi Gas Chemical Company, Inc.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP 18105997 2018.06.01 JP 18149063 2018.08.08
- International Application: PCT/JP2019/021694 2019.05.31
- International Announcement: WO2019/230945A 2019.12.05
- Date entered country: 2020-11-30
- Main IPC: C08L53/02
- IPC: C08L53/02 ; B32B5/02 ; B32B15/08 ; B32B15/14 ; B32B15/20 ; C08J5/24 ; C08L71/12 ; C09D153/02 ; C09D171/12 ; H05K1/03

Abstract:
A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.
Public/Granted literature
- US20210214547A1 Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board Public/Granted day:2021-07-15
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