Invention Grant
- Patent Title: Method of depositing a metal layer on a component
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Application No.: US18463350Application Date: 2023-09-08
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Publication No.: US12091768B2Publication Date: 2024-09-17
- Inventor: Sriram Krishnamurthy , Lakshmi Krishnan , Elzbieta Kryj-Kos , Justin M. Welch
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US OH Cincinnati
- Agency: Dority & Manning, P.A.
- Main IPC: C23C28/00
- IPC: C23C28/00 ; C25D5/54 ; C25D5/56 ; C25D7/00

Abstract:
A method for depositing a metal layer on a component includes applying an electrically conductive coating composition comprising a resin and metal particles on a coating region of the component and partially curing the resin to a gel state to form an electrically conductive coating. The method also includes applying additional metal particles to the partially cured resin in the gel state and depositing, via an electrodeposition process, a metal layer on the electrically conductive coating.
Public/Granted literature
- US20240018683A1 METHOD OF DEPOSITING A METAL LAYER ON A COMPONENT Public/Granted day:2024-01-18
Information query
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