Invention Grant
- Patent Title: Nitride semiconductor substrate, laminated structure, and method for manufacturing nitride semiconductor substrate
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Application No.: US17426334Application Date: 2020-01-23
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Publication No.: US12091774B2Publication Date: 2024-09-17
- Inventor: Takehiro Yoshida
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 19016908 2019.02.01
- International Application: PCT/JP2020/002333 2020.01.23
- International Announcement: WO2020/158571A 2020.08.06
- Date entered country: 2021-10-22
- Main IPC: C30B29/40
- IPC: C30B29/40 ; C30B25/20 ; C30B33/00 ; H01L29/04 ; H01L29/20 ; H01L29/34

Abstract:
A nitride semiconductor substrate that is constituted by a single crystal of a group III nitride semiconductor and includes a main surface for which the closest low index crystal plane is a (0001) plane includes an inclined interface growth region that has grown with inclined interfaces other than the (0001) plane serving as growth surfaces. A ratio of an area occupied by the inclined interface growth region in the main surface is 80% or more. When a dislocation density is determined based on a dark spot density by observing the main surface in a field of view that is 250 μm square using a multiphoton excitation microscope, the main surface does not include a region that has a dislocation density higher than 3×106 cm−2, and the main surface includes dislocation-free regions that are 50 μm square and do not overlap each other, at a density of 100 regions/cm2 or more.
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