The embodiments disclose a process for manufacturing a sensor including depositing a first conductive layer on a substrate followed by curing the first conductive layer and, depositing a temperature controlling conductive ink on top of a portion of the first conductive layer followed by curing the temperature controlling conductive ink and, depositing an insulating layer on top of the temperature controlling conductive ink layer and a portion of the first conductive layer followed by curing the insulating layer and, depositing a second conductive layer on top of a portion of first conductive layer followed by curing the second conductive layer and, depositing an adhesive layer on top of a portion of the first conductive layer for adhering a memory chip to the first conductive layer followed by curing the adhesive layer and, depositing at least one biomolecule layer on top of the second conductive layer followed by drying the at least one biomolecule layer.