Invention Grant
- Patent Title: Simulating heat flux in additive manufacturing
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Application No.: US17275735Application Date: 2019-09-13
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Publication No.: US12093614B2Publication Date: 2024-09-17
- Inventor: Reza Yavari , Prahalada Krishna Rao , Kevin Cole
- Applicant: NUtech Ventures
- Applicant Address: US NE Lincoln
- Assignee: NUtech Ventures
- Current Assignee: NUtech Ventures
- Current Assignee Address: US NE Lincoln
- Agency: Fish & Richardson P.C.
- International Application: PCT/US2019/051192 2019.09.13
- International Announcement: WO2020/056388A 2020.03.19
- Date entered country: 2021-03-12
- Main IPC: G06F30/23
- IPC: G06F30/23 ; G06F111/10 ; G06F113/10 ; G06F119/08

Abstract:
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for simulating heat transfer in additive manufacturing. Implementations disclosed herein convert a model of an object into a node representation of the object, and generate an adjacency matrix of the object based on the node representation. For each layer of nodes in the node representation, implementations apply a simulated heat to the layer of nodes, and estimating a diffusion of heat to other nodes based on the adjacency matrix. Implementations generate a representation of an estimated heat distribution within the object.
Public/Granted literature
- US20220058315A1 SIMULATING HEAT FLUX IN ADDITIVE MANUFACTURING Public/Granted day:2022-02-24
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