Invention Grant
- Patent Title: Relocatable FPGA modules
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Application No.: US18226108Application Date: 2023-07-25
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Publication No.: US12093623B2Publication Date: 2024-09-17
- Inventor: Michael Riepe , Kamal Choundhary , Amit Singh , Shirish Jawale , Karl Koehler , Simon Longcroft , Scott Senst , Clark Hilbert , Kent Orthner
- Applicant: Achronix Semiconductor Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Achronix Semiconductor Corporation
- Current Assignee: Achronix Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F30/30
- IPC: G06F30/30 ; G06F15/78 ; G06F30/31 ; G06F30/347 ; G06F30/392

Abstract:
A logic block can be relocated without recompilation from a first area to a second area on a field-programmable gate array (FPGA) if the pattern of fabric tiles in the second area is the same as the pattern of fabric tiles in the first area, and if the two areas have the same dimensions. The design system runs synthesis, placement, and routing on a partition of a design at a first location, exports that partition to a persistent on-disk database, imports one or multiple copies of the partition into a larger design, and moves one or more of the copies from the first area to a target area in the larger design. The compatibility of the second area may be identified based on fabric tile signatures of the first area and the second area.
Public/Granted literature
- US20230367940A1 RELOCATABLE FPGA MODULES Public/Granted day:2023-11-16
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