- Patent Title: Semiconductor inspection device and semiconductor inspection method
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Application No.: US17608833Application Date: 2020-04-16
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Publication No.: US12094138B2Publication Date: 2024-09-17
- Inventor: Tomochika Takeshima , Takafumi Higuchi , Kazuhiro Hotta
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP 19103830 2019.06.03
- International Application: PCT/JP2020/016739 2020.04.16
- International Announcement: WO2020/246149A 2020.12.10
- Date entered country: 2021-11-04
- Main IPC: G06T7/30
- IPC: G06T7/30 ; G06T11/00 ; G06F30/392

Abstract:
An observation system includes a detector that detects light from a semiconductor device and outputs a detection signal, a 2D camera, an optical device that guides light to the detector and the 2D camera, an image processing unit that generates a first optical image of the semiconductor device based on the detection signal and receives an input of a first CAD image, an image analysis unit that learns a conversion process of the first CAD image by machine learning using the first optical image as training data, and converts the first CAD image into a second CAD image resembling the first optical image by the conversion process based on a result of the learning, and an alignment unit that performs alignment based on a second optical image and the second CAD image.
Public/Granted literature
- US20220301197A1 SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR INSPECTION METHOD Public/Granted day:2022-09-22
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