Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US17392217Application Date: 2021-08-02
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Publication No.: US12094732B2Publication Date: 2024-09-17
- Inventor: Keisuke Miyajima , Keiji Magara , Takashi Katayama
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JP 20131782 2020.08.03
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02

Abstract:
A substrate processing method includes step S51, step S52, and step S6. In step S51, a substrate immersed in a rinsing liquid is lifted from the rinsing liquid and the substrate is immersed in a rinsing liquid stored in a tank in a chamber while an organic solvent having a surface tension smaller than that of the rinsing liquid adheres to the substrate. In step S52, the substrate is lifted from the rinsing liquid. In step S6, a vapor of an organic solvent having a surface tension smaller than that of the rinsing liquid is supplied into the chamber in which the lifted substrate exists.
Public/Granted literature
- US20220037173A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-02-03
Information query
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