- Patent Title: Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor device
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Application No.: US17414954Application Date: 2019-12-16
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Publication No.: US12094749B2Publication Date: 2024-09-17
- Inventor: Shogo Sobue , Yasuyuki Ooyama , Yushi Yamaguchi
- Applicant: Resonac Corporation
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Agency: SOEI PATENT & LAW FIRM
- Priority: JP 18238562 2018.12.20
- International Application: PCT/JP2019/049245 2019.12.16
- International Announcement: WO2020/129917A 2020.06.25
- Date entered country: 2021-06-17
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C09J133/04 ; C09J161/04 ; C09J163/00
Abstract:
A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa·s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.
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