Invention Grant
- Patent Title: Method of processing a substrate
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Application No.: US17819672Application Date: 2022-08-15
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Publication No.: US12094751B2Publication Date: 2024-09-17
- Inventor: Karl Heinz Priewasser
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: DE 2021209979.3 2021.09.09
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/683

Abstract:
Methods of processing a substrate having one side and an opposite side include providing a protective film having a front surface and a back surface, and applying a water-soluble material to at least a central area of the front surface of the protective film and/or applying a water-soluble material to at least a central portion of the one side of the substrate. The protective film is applied to the one side of the substrate, wherein the front surface of the protective film faces the one side of the substrate and no adhesive is between at least the central area of the front surface of the protective film and the one side of the substrate. An external stimulus is applied to the protective so that the protective film is attached to the one side of the substrate, and the substrate can be processed.
Public/Granted literature
- US20230072652A1 METHOD OF PROCESSING A SUBSTRATE Public/Granted day:2023-03-09
Information query
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