Method of processing a substrate
Abstract:
Methods of processing a substrate having one side and an opposite side include providing a protective film having a front surface and a back surface, and applying a water-soluble material to at least a central area of the front surface of the protective film and/or applying a water-soluble material to at least a central portion of the one side of the substrate. The protective film is applied to the one side of the substrate, wherein the front surface of the protective film faces the one side of the substrate and no adhesive is between at least the central area of the front surface of the protective film and the one side of the substrate. An external stimulus is applied to the protective so that the protective film is attached to the one side of the substrate, and the substrate can be processed.
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