Invention Grant
- Patent Title: Semiconductor device having an antenna arranged over an active main surface of a semiconductor die
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Application No.: US16360387Application Date: 2019-03-21
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Publication No.: US12094842B2Publication Date: 2024-09-17
- Inventor: Thorsten Meyer , Walter Hartner , Maciej Wojnowski
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2016107678.3 2016.04.26
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/00 ; H01L23/31 ; H01L23/66 ; H01L29/06 ; H01Q1/22
Abstract:
A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The semiconductor device further includes an antenna arranged on the active main surface of the semiconductor die and a recess arranged on the opposite main surface of the semiconductor die. The recess is arranged over the antenna.
Public/Granted literature
- US20190221531A1 On-Chip Antennas for Semiconductor Devices and Related Manufacturing Methods Public/Granted day:2019-07-18
Information query
IPC分类:
